JPH0319258Y2 - - Google Patents
Info
- Publication number
- JPH0319258Y2 JPH0319258Y2 JP1981159192U JP15919281U JPH0319258Y2 JP H0319258 Y2 JPH0319258 Y2 JP H0319258Y2 JP 1981159192 U JP1981159192 U JP 1981159192U JP 15919281 U JP15919281 U JP 15919281U JP H0319258 Y2 JPH0319258 Y2 JP H0319258Y2
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- bonded
- hybrid integrated
- members
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15919281U JPS5866690U (ja) | 1981-10-26 | 1981-10-26 | ハイブリツド集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15919281U JPS5866690U (ja) | 1981-10-26 | 1981-10-26 | ハイブリツド集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5866690U JPS5866690U (ja) | 1983-05-06 |
JPH0319258Y2 true JPH0319258Y2 (en]) | 1991-04-23 |
Family
ID=29951654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15919281U Granted JPS5866690U (ja) | 1981-10-26 | 1981-10-26 | ハイブリツド集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5866690U (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55162297A (en) * | 1979-06-04 | 1980-12-17 | Fujitsu Ltd | Method of mounting microwave integrated circuit board |
-
1981
- 1981-10-26 JP JP15919281U patent/JPS5866690U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5866690U (ja) | 1983-05-06 |
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